indian engineering congress update

Author: Dhruva Shaw

.pre-commit-config.yaml

@@ -4,7 +4,7 @@ repos:
   - repo: https://github.com/pre-commit/pre-commit-hooks
     rev: v4.3.0
     hooks:
-      - id: trailing-whitespace
-      - id: end-of-file-fixer
-      - id: check-yaml
-      - id: check-added-large-files
+      # - id: trailing-whitespace
+      # - id: end-of-file-fixer
+      # - id: check-yaml
+      # - id: check-added-large-files

_pages/extras/standards_committee.md

@@ -21,11 +21,13 @@ This standard defines a framework including requirements and evaluation methods
 [IEEE SA WG - P3348](https://standards.ieee.org/ieee/3348/11180/)
 
 ## IEEE SA WG - P3514 [Recommended Practice for Levels of Artificial Intelligence Capabilities for AI Entities and Applications]
+
 This recommended practice defines levels of capabilities of Artificial Intelligence (AI). The capability levels can be used to classify AI entities after benchmarking and evaluation. Evaluation criteria and specific benchmarks are provided for common capabilities per typical application scenarios/domains (e.g., AI used in a personal computer, in a mobile phone, or by robots).
 
 [IEEE SA WG - P3514](https://standards.ieee.org/ieee/3514/11739/)
 
 ## IEEE SA WG - P62659 [Standard for Nanomanufacturing -- Large Scale Manufacturing for Nanoelectronics]
+
 This International Standard provides a framework for introducing nanoelectronics into large scale, high volume production in semiconductor manufacturing facilities through the incorporation of nanomaterials (e.g. carbon nanotubes, graphene, quantum dots, etc.). Since semiconductor manufacturing facilities need to incorporate practices that maintain high yields, there are very strict requirements for how manufacturing is performed. Nanomaterials represent a potential contaminant in semiconductor manufacturing facilities and need to be introduced in a structured and methodical way. This International Standard provides steps employed to facilitate the introduction of nanomaterials into the semiconductor manufacturing facilities. This sequence is described under the areas of raw materials acquisition, materials processing, design, integrated circuits (IC) fabrication, testing, and end-use. These activities represent the major stages of the supply chain in semiconductor manufacturing facilities.
 
 [IEEE SA WG - P62659](https://standards.ieee.org/ieee/62659/11082/)

_projects/mcba.md

@@ -198,7 +198,7 @@ Our next step was to present our work to a wider audience. We had the privilege
 Building upon our initial successes, we aimed to further elevate our research by presenting our work at a prestigious national platform. We were thrilled to be selected for an oral presentation at the India Science Congress 2023. Although the conference has been postponed due to unforeseen circumstances on the organizers' end, we eagerly anticipate the opportunity to share our findings with the scientific community at the rescheduled event.
 
 <div class="containerpdf">
-    <iframe src='https://media.licdn.com/dms/document/media/v2/D562DAQGOF_iYu33xFw/profile-treasury-document-pdf-analyzed/profile-treasury-document-pdf-analyzed/0/1733040323273?e=1735171200&v=beta&t=5olBsD8ULmzjBA8nxGY5v0j4tX6P0BbWnAiPdFWg4iE' class="responsive-object-pdf" type='application/pdf'></iframe>
+    <iframe src='{{ site.url }}/assets/pdf/isc24_acceptanceletter.pdf' class="responsive-object-pdf" type='application/pdf'></iframe>
 </div>
 
 ### 4. A Triumph at IIT Ropar: Second Place at EE Research Day
@@ -260,10 +260,20 @@ We then set our sights on the 2024 IEEE Standards Association Telehealth Tech Pi
     <iframe width="560" height="315" class="responsive-object-pdf" src="https://www.youtube.com/embed/pU9OGLIYMsE?si=sPKLxx6YKQ6C9mzD" title="YouTube video player" frameborder="0" allow="accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share" referrerpolicy="strict-origin-when-cross-origin" allowfullscreen></iframe>
 </div>
 
-### 6. Looking Forward to the Indian Engineering Congress 2024
+### 6. The 39th Indian Engineering Congress 2024
 
 We are delighted to announce that our research paper has been accepted for oral presentation at the Indian Engineering Congress 2024. We are eager to present our findings at this prestigious conference and anticipate making a significant impact on the engineering community.
 
+<div class="containerpdf">
+    <iframe src='{{ site.url }}/assets/pdf/iec_certificate.pdf' class="responsive-object-pdf" type='application/pdf'></iframe>
+</div>
+<div class="containerpdf">
+    <iframe src='{{ site.url }}/assets/pdf/bookofabstracts.pdf' class="responsive-object-pdf" type='application/pdf'></iframe>
+</div>
+<div class="containerpdf">
+    <iframe width="560" height="315" src="https://www.youtube.com/embed/T8JX1OMt7ko?si=ZoHrOgGlHeFlHTc9" title="YouTube video player" frameborder="0" allow="accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share" referrerpolicy="strict-origin-when-cross-origin" allowfullscreen></iframe>
+</div>
+
 ---
 
 ## Methodology
@@ -358,7 +368,7 @@ Here is the protocol(steps) to reproduce our work with ease. [Published in Proto
 
 <iframe src="https://www.protocols.io/widgets/doi?uri=dx.doi.org/10.17504/protocols.io.n92ldr869g5b/v1" style="width: 100%; height: 300px; border: 1px solid transparent;"></iframe>
 <div class="containerpdf">
-    <iframe src='{{ site.url }}/assets/pdf/protocol_mcba.pdf' class="responsive-object-pdf" type='application/pdf'></iframe>
+    <iframe src='{{ site.url }}/assets/pdf/mcba/protocol_mcba.pdf' class="responsive-object-pdf" type='application/pdf'></iframe>
 </div>
 
 ---
@@ -539,6 +549,14 @@ It contains two different simulink simulation files with a data files, all are r
 - [http://dx.doi.org/10.13140/RG.2.2.29113.68961](http://dx.doi.org/10.13140/RG.2.2.29113.68961)
 - [http://dx.doi.org/10.13140/RG.2.2.17245.12004](http://dx.doi.org/10.13140/RG.2.2.17245.12004)
 
+### 39th Indian Engineering Congress 2024
+
+- [https://www.youtube.com/watch?v=T8JX1OMt7ko](https://www.youtube.com/watch?v=T8JX1OMt7ko)
+- [https://www.researchgate.net/publication/387459720_Mind_Controlled_Bionic_Arm_with_Sense_of_Touch](https://www.researchgate.net/publication/387459720_Mind_Controlled_Bionic_Arm_with_Sense_of_Touch)
+- [https://www.researchgate.net/publication/387459543_Mind_Controlled_Bionic_Arm_with_Sense_of_Touch](https://www.researchgate.net/publication/387459543_Mind_Controlled_Bionic_Arm_with_Sense_of_Touch)
+- [{{ site.url }}/assets/pdf/bookofabstracts.pdf]({{ site.url }}/assets/pdf/bookofabstracts.pdf)
+- [{{ site.url }}/assets/pdf/iec_certificate.pdf]({{ site.url }}/assets/pdf/iec_certificate.pdf)
+
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